Wire bonding

Packaging > Bonding

Description

Wire bonding is the part of the fabrication that allows an electrical component to communicate with the outside world. A thin electrically conductive wire – typically gold, aluminium, copper or silver – is used to allow electricity to flow from contacts on the component to, or from, its packaging....

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

K&S 4523 (UNSW)

Wedge bonder

NSW

NSW

  • Description
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  • Tool Owner
  • Description

    More information to come

  • Related Information

    More information to come

  • Tool Owner

Kulicke & Soffa 4526 Wedge Bonder (UQ)

Wedge Bonder

QLD

QLD

  • Description
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  • Tool Owner
  • Description

    Wire bonder for power semiconductors, automotive power modules and industrial hybrids and prototypes

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    Ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 – 80 x 12 mils).

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TPT HB16 (UQ)

Wedge and ball bonder

QLD

QLD

  • Description
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  • Tool Owner
  • Description

    Wire Bonder with motorised Z- and Y-Axis and is capable of performing both wedge and ball bonding.

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    Wire materials – Gold, silver, aluminium, copper.

    Wire sizes 17 – 75 µm.

    Ribbon sizes up to 25×250 µm.

    Deep access wedge 16mm and ball 13mm.

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F&S Bondtec Deep-access 5832 (MCN)

Wire bonder with pull head and general upgrades

VIC

VIC

  • Description
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  • Description

    Deep access wire bonder suitable for wedge bonding..

    Deep access wedge allows for the bonding of devices with tight and constricted geometries.

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    Allows for stitch bonding as well as programmable bond maps.

    Uses Al-Si or gold wire, or gold ribbon.

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Kulicke & Soffa 4526 Wedge Bonder (UWA)

Wedge Bonder

WA

WA

  • Description
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  • Tool Owner
  • Description

    Manual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid adjustment of individual bonding parameters.

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    Ultrasonically bonding a wide range of gold or aluminium wires and ribbons from 12 – 75 micron wire through 25 x 250 micron ribbon.

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