Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
MTI Saw (MQ)
Diamond wire saw and Wafer Saw
Optofab
Optofab
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Description
Diamond wire saw and Wafer Saw for preparing small samples of glass from ingots or wafers
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Related Information
Typical prepares 10-40mm areas samples of glass for photonic inscription
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Tool Owner
ADT Provectus 7100 (UQ)
Wafer dicer
QLD
QLD
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Description
Fully programmable dicing saw capable of dicing up to 8 inch wafers.
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Related Information
Provides high precision dicing, best performing matrix for hard, brittle and composite materials.
Can dice hard and thick materials.
Saw blade minimal width of 20 µm.
Axis resolution in Y of 200 nm and Z of 200nm.
Speed up to 350 mm/s.
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Tool Owner
Disco DAD 321 (UniSA)
Wafer dicer
SA
SA
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Description
Wafer dicer capable of dicing 6-inch wafers
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Related Information
The DISCO DAD 321 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.
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Tool Owner
Accretech SS20 (UniSA)
Wafer dicer
SA
SA
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Description
The Accretech SS20 dicing saw uses a rotating ultra-thin diamond impregnated blade in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges.
Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.
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Related Information
Wafer dicer capable of dicing 6-inch wafers.
Capable of processing materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic.
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Tool Owner
