Wafer dicing

Packaging > Wafer Processing

Description

Nanofabricated devices are generally made in batches on wafers and need to be separated or packaged before use. This separation can be achieved through wet or dry dicing. In a wet dicing operation, a precision, high-speed, diamond impregnated blade is used to mill narrow grooves between the devices either...

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List of Available Tools

Tool Make and Model

Key Differentiator

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MTI Saw (MQ)

Diamond wire saw and Wafer Saw

Optofab

Optofab

  • Description
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  • Description

    Diamond wire saw and Wafer Saw for preparing small samples of glass from ingots or wafers

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    Typical prepares 10-40mm areas samples of glass for photonic inscription

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ADT Provectus 7100 (UQ)

Wafer dicer

QLD

QLD

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  • Description

    Fully programmable dicing saw capable of dicing up to 8 inch wafers.

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    Provides high precision dicing, best performing matrix for hard, brittle and composite materials.

    Can dice hard and thick materials.

    Saw blade minimal width of 20 µm.

    Axis resolution in Y of 200 nm and Z of 200nm.

    Speed up to 350 mm/s.

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Disco DAD 321 (UniSA)

Wafer dicer

SA

SA

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  • Description

    Wafer dicer capable of dicing 6-inch wafers

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    The DISCO DAD 321 dicing saw uses a rotating ultra-thin diamond impregnated blade, in a wet environment, to cut materials such as silicon wafers, III-V semiconductors, glass sheets, ceramic, etc. into almost any shapes with straight edges. Cutting process is controlled automatically through software recipe programming. The machine is also capable of accurate, multi-directional on-screen semiautomatic alignment.

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