Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
Finetech Fineplacer Lambda (ANU)
Flip chip bonder
ACT
ACT
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Description
Used to align and place/bond chips on PCB or larger chips using metal bonding
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Related Information
0.5 micron placement accuracy.
Substrate temperature 400 degrees C.
Thermocompression bonding.
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Tool Owner
Finetech FINEPLACER lambda (USYD)
Sub-Micron Die Bonder
NSW
NSW
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Description
Sub-micron die-bonder for precision die attach and advanced chip packaging.
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Related Information
Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module.
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Tool Owner
EVG 520 (UniSA)
Substrate bonder
SA
SA
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Description
Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.
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Related Information
Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.
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Tool Owner
Finetech Fineplacer-96 (UWA)
Flip chip bonder
WA
WA
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Description
Manual flip chip bonder with high accuracy of 0.5 μm.
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Related Information
Max. die/package size: 16 mm (pick-n-place only)
Min. die/package size: 0.5 mm
Substrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)
Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N).
Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
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Tool Owner
