Wafer bonding

Packaging > Bonding

Description

Bonding a wafer to another wafer is a step commonly used when packaging components in an micro or nanoelectrical device. It can help a form new functions in a device, or can ensure mechanical and hermetic encapsulation of devices and electronics. The result is irreversible.

Common bonding methods include...

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

Finetech Fineplacer Lambda (ANU)

Flip chip bonder

ACT

ACT

  • Description
  • Related Information
  • Tool Owner
  • Description

    Used to align and place/bond chips on PCB or larger chips using metal bonding

  • Related Information

    0.5 micron placement accuracy.

    Substrate temperature 400 degrees C.

    Thermocompression bonding.

  • Tool Owner

Finetech FINEPLACER lambda (USYD)

Sub-Micron Die Bonder

NSW

NSW

  • Description
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  • Tool Owner
  • Description

    Sub-micron die-bonder for precision die attach and advanced chip packaging.

  • Related Information

    Ultrasonic or thermosonic bonding, formic acid, adhesive dispense module.

  • Tool Owner

EVG 520 (UniSA)

Substrate bonder

SA

SA

  • Description
  • Related Information
  • Tool Owner
  • Description

    Designed for bonding, embossing and nanoimprinting applications the system can thermally bond glass substrates and emboss channel geometries into substrates.

  • Related Information

    Capable of all wafer bonding processes such as thermo-compression, fusion or low temperature bonding. It is configured to allow hot embossing of polymers and even glass.

  • Tool Owner

Finetech Fineplacer-96 (UWA)

Flip chip bonder

WA

WA

  • Description
  • Related Information
  • Tool Owner
  • Description

    Manual flip chip bonder with high accuracy of 0.5 μm.

  • Related Information

    Max. die/package size: 16 mm (pick-n-place only)

    Min. die/package size: 0.5 mm

    Substrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)

    Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N).

    Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.

  • Tool Owner

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