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Capabilities

Vapour phase etching

Etching > Dry Etching

Description

Vapour phase etching involves exposing a substrate to a corrosive chemical in vapour form which will remove material that it comes into contact with. The sections of material that are removed can be selected by protecting parts of the substrate that are desired to be kept with a mask or coating.

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

Custom HF etching (UoA)

HF etching facilities

Optofab

Optofab

  • Description
  • Related Information
  • Tool Owner
  • Description

    Hydrofluoric acid etching facilities.

  • Related Information

    Hydrofluoric etching facilities in a specialised laboratory environment. Capability to etch glass and other materials.

  • Tool Owner

Custom Etcher (UQ)

XeF2 etcher

QLD

QLD

  • Description
  • Related Information
  • Tool Owner
  • Description

    System used for isotropic etching of silicon using xenon difluoride gas.

  • Related Information

    This system has almost infinite selectivity to SiO2, SiN and photoresist.

    Can handle up to 4 inch wafers.

    Etch rate of up to several microns per minute.

  • Tool Owner

ANFF-Q HF Vapour Etch (UQ)

HF Vapour Etcher

QLD

QLD

  • Description
  • Related Information
  • Tool Owner
  • Description

    Performs dry etching of SiO2. HF vapour chemically etches SIO2 while substrate is heated

  • Related Information

    Allows stiction free release of mechanical structures.

  • Tool Owner

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