Thermal Scanning Probe Lithography (t-SPL) is a 3D direct-write lithography technique that provides sub-10nm resolution with sub-2nm vertical accuracy in ambient conditions.

A 1,000°C cantilevered tip sublimates PPA resist as it scans over a sample, before the tip quickly cools to provide real-time topological AFM-type characterisation.

The process isn’t reliant on an ion gun or electron beam (helpful when processing sensitive materials);
it operates at ambient temperature, pressure, low voltage, and under N2 atmosphere instead of requiring a specialist environment. The ease of use and high resolution means it is ideal for rapid fabrication of three-dimensional nanostructures including the fabrication of novel devices and components for nanophotonics, nanooptics, nanoelectronics, and plasmonics applications.