Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
Laurell WS-400A (UoN)
Spin coater for ink coatings
Materials Node
Materials Node
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Description
Used to produce thin films on small substrates. The sample is placed onto a vacuum chuck and rotated at thousands of revolutions per minute whilst ink is deposited onto the surface. The majority of the ink is removed due to the rotation but what’s left is an extremely thin, uniform film.
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Related Information
Typical sample sizes are 1-2 cm2. Speeds from 200 to 8000 rpm are possible.
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Tool Owner
Rite Track SVG 88 (USYD)
Spin coater and developer
NSW
NSW
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Description
A fully automated system for spin coating, HMDS application, baking, and development. The system is well suited to batch scale production, providing high process performance and consistency in coating and development.
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Related Information
The system can process 4 and 6 inch wafers, and is capable of running 25 wafers at a time.
Auto dispense of resist (standard SPR660).
MF26 developer.
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Tool Owner
PM-Plast Delta 15 (USYD)
Mask Cleaning tool
NSW
NSW
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Description
Automated single wafer cleaning tool
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Related Information
Primarily dedicated to mask cleaning
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Tool Owner
SSE OPTIcoat ST22 (Griffith)
Resist developer
QLD
QLD
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Description
Uses a vacuum chuck to spin the wafer whilst a specific amount of photoresist is deposited on the surface of the substrate. Spin speeds and volumes are variable to allow for different thickness and uniformity requirements.
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Related Information
An essential part of photolithography.
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Tool Owner
Suss Delta 80 (UniSA)
Spin coater
SA
SA
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Description
Used to evenly and repeatably coat substrates with polymer films
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Related Information
Capable of applying uniform thickness polymer films, such as a resist to substrates a “Gyrset” to help achieve uniformity, especially on square and rectangular substrates and to minimise edge bead build up.
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Tool Owner
PicoTRACK PCT-150RRE (MCN)
Automated spin-coating and wafer developing system
VIC
VIC
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Description
A fully automated system for wafer processing which includes spin coating, HMDS application, baking, and development.
The system is well suited to batch scale production, providing high process performance and consistency in coating and development.
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Related Information
Substrate size – 4 and 6 inch wafers. Batch process size – up to 25 wafers at a time.
Resist system used – AZ 1512 and AZ 4562 photoresists to coat wafers and AZ 400K for development.
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Tool Owner
Suss Delta RC80+ (MCN)
Spin coater
VIC
VIC
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Description
Spin coater set up to process 4-inch wafers and also features a hot plate.
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Related Information
high uniformity spin coater.
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Tool Owner
EVG Group EVG105 (UWA)
Photolithography thermal curing
WA
WA
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Description
Softbake, post-exposure bake and hardbake processes. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles
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Related Information
Process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time
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Tool Owner
