Spin coating and wafer development

Lithography > Support Systems

Description

Spin coaters are capable of applying uniform thickness polymer films, such as a resist to substrates. Resist is essential for many types of lithography, such as UV lithography. Resists are termed either positive or negative — this denotes whether, when cured, chemical bonds are made or broken, and...

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

Laurell WS-400A (UoN)

Spin coater for ink coatings

Materials Node

Materials Node

  • Description
  • Related Information
  • Tool Owner
  • Description

    Used to produce thin films on small substrates. The sample is placed onto a vacuum chuck and rotated at thousands of revolutions per minute whilst ink is deposited onto the surface. The majority of the ink is removed due to the rotation but what’s left is an extremely thin, uniform film.

  • Related Information

    Typical sample sizes are 1-2 cm2. Speeds from 200 to 8000 rpm are possible.

  • Tool Owner

Rite Track SVG 88 (USYD)

Spin coater and developer

NSW

NSW

  • Description
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  • Tool Owner
  • Description

    A fully automated system for spin coating, HMDS application, baking, and development. The system is well suited to batch scale production, providing high process performance and consistency in coating and development.

  • Related Information

    The system can process 4 and 6 inch wafers, and is capable of running 25 wafers at a time.

    Auto dispense of resist (standard SPR660).

    MF26 developer.

  • Tool Owner

PM-Plast Delta 15 (USYD)

Mask Cleaning tool

NSW

NSW

  • Description
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  • Tool Owner
  • Description

    Automated single wafer cleaning tool

  • Related Information

    Primarily dedicated to mask cleaning

  • Tool Owner

SSE OPTIcoat ST22 (Griffith)

Resist developer

QLD

QLD

  • Description
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  • Tool Owner
  • Description

    Uses a vacuum chuck to spin the wafer whilst a specific amount of photoresist is deposited on the surface of the substrate. Spin speeds and volumes are variable to allow for different thickness and uniformity requirements.

  • Related Information

    An essential part of photolithography.

  • Tool Owner

Suss Delta 80 (UniSA)

Spin coater

SA

SA

  • Description
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  • Tool Owner
  • Description

    Used to evenly and repeatably coat substrates with polymer films

  • Related Information

    Capable of applying uniform thickness polymer films, such as a resist to substrates a “Gyrset” to help achieve uniformity, especially on square and rectangular substrates and to minimise edge bead build up.

  • Tool Owner

PicoTRACK PCT-150RRE (MCN)

Automated spin-coating and wafer developing system

VIC

VIC

  • Description
  • Related Information
  • Tool Owner
  • Description

    A fully automated system for wafer processing which includes spin coating, HMDS application, baking, and development.

    The system is well suited to batch scale production, providing high process performance and consistency in coating and development.

  • Related Information

    Substrate size – 4 and 6 inch wafers. Batch process size – up to 25 wafers at a time.

    Resist system used – AZ 1512 and AZ 4562 photoresists to coat wafers and AZ 400K for development.

  • Tool Owner

Suss Delta RC80+ (MCN)

Spin coater

VIC

VIC

  • Description
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  • Tool Owner
  • Description

    Spin coater set up to process 4-inch wafers and also features a hot plate.

  • Related Information

    high uniformity spin coater.

  • Tool Owner

EVG Group EVG105 (UWA)

Photolithography thermal curing

WA

WA

  • Description
  • Related Information
  • Tool Owner
  • Description

    Softbake, post-exposure bake and hardbake processes. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles

  • Related Information

    Process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time

  • Tool Owner

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