Multiple mask lithography

Lithography > Photolithography

Description

Photolithography is used to create a pattern on a substrate by shining light from a light source onto a photoresist that coats the surface of the substrate through a photomask and is followed by a development phase.

Depending on the complexity of a device’s design, various deposition, etching and...

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

EVG 620 (UQ)

Mask aligner and resist exposure system

QLD

QLD

  • Description
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  • Description

    Multilayer exposures of photoresists through a mask. Can resolve alignment marks down to 1µm and perform front and backside alignment on both 4 and 6 inch wafers.

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    Any photoresist that can be exposed with 365 and 405nm.

    The system provides controlled pressure between the mask and the resist coated substrate.

    A shutter opens and closes providing a specific dose of UV to the exposed resist.

  • Tool Owner

EVG 620 (UniSA)

Mask aligner and resist exposure system with NIL capability

SA

SA

  • Description
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  • Tool Owner
  • Description

    High resolution double side mask aligner with split-field microscopes which is capable of handling multiple wafer sizes with quick change-over time.

    Capable of processing ceramics, glasses, metals, polymers and semiconductors

  • Related Information

    Used for a variety of applications to transfer multiple layers of nanoscale patterns into photoresist films.

  • Tool Owner

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