Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
EVG 620 (UQ)
Mask aligner and resist exposure system
QLD
QLD
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Description
Multilayer exposures of photoresists through a mask. Can resolve alignment marks down to 1µm and perform front and backside alignment on both 4 and 6 inch wafers.
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Related Information
Any photoresist that can be exposed with 365 and 405nm.
The system provides controlled pressure between the mask and the resist coated substrate.
A shutter opens and closes providing a specific dose of UV to the exposed resist.
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Tool Owner
EVG 620 (UniSA)
Mask aligner and resist exposure system with NIL capability
SA
SA
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Description
High resolution double side mask aligner with split-field microscopes which is capable of handling multiple wafer sizes with quick change-over time.
Capable of processing ceramics, glasses, metals, polymers and semiconductors
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Related Information
Used for a variety of applications to transfer multiple layers of nanoscale patterns into photoresist films.
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Tool Owner