Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
EVG 520 (ANU)
Hot embossing and wafer bonding
ACT
ACT
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Description
Hot Embossing, Nanoimpint lithography, and wafer bonding
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Related Information
Process up to a 6 inch wafer, 500 degrees C max temperature.
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Tool Owner
EVG 520 (UQ)
Hot embossing tool for 6 inch wafers
QLD
QLD
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Description
Can emboss wafers of up to 6-inch diameter. Can also perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.
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Related Information
Used for controlled embossing into substrates such as polycarbonate and COC.
Can also perform wafer bonding.
Temperature of 650°C and pressures of 60kN are possible. Power supply for anodic bonding: 0 – 2.000 V/50 mA
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Tool Owner
EVG 520 (MCN)
Hot embossing tool
VIC
VIC
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Description
Can emboss wafers and perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.
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Related Information
Used for controlled embossing into polycarbonate and COC substrates of up to 6 inches in diameter.
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Tool Owner