Hot embossing

Lithography > Embossing

Description

Hot embossing is a pattern-transfer technique, involving the application of pressure and heat to a polymeric or resist-coated substrate, placed in contact with a master mould. This allows the relief features on the mould to be transferred faithfully. Hot embossing achieves fast patterning at a resolution...

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

EVG 520 (ANU)

Hot embossing and wafer bonding

ACT

ACT

  • Description
  • Related Information
  • Tool Owner
  • Description

    Hot Embossing, Nanoimpint lithography, and wafer bonding

  • Related Information

    Process up to a 6 inch wafer, 500 degrees C max temperature.

  • Tool Owner

EVG 520 (UQ)

Hot embossing tool for 6 inch wafers

QLD

QLD

  • Description
  • Related Information
  • Tool Owner
  • Description

    Can emboss wafers of up to 6-inch diameter. Can also perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.

  • Related Information

    Used for controlled embossing into substrates such as polycarbonate and COC.

    Can also perform wafer bonding.

    Temperature of 650°C and pressures of 60kN are possible. Power supply for anodic bonding: 0 – 2.000 V/50 mA

  • Tool Owner

EVG 520 (MCN)

Hot embossing tool

VIC

VIC

  • Description
  • Related Information
  • Tool Owner
  • Description

    Can emboss wafers and perform bonding such as anodic bonding, fusion bonding, eutectic bonding and epoxy bonding.

  • Related Information

    Used for controlled embossing into polycarbonate and COC substrates of up to 6 inches in diameter.

  • Tool Owner

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