Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
Barrell Melt extrusion pot (UoW)
Polymer melting pot
Materials Node
Materials Node
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Description
Pneumatic melt pot extruder
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Related Information
250g max
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Tool Owner
Custom Glass melter (UoA)
Controlled atmosphere oxide glass melting facilities.
Optofab
Optofab
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Description
Facility consisting of a 6-port glovebox with integrated furnaces
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Related Information
Consists of one 900 degree C melting furnace, and three 500 C degree annealing furnaces.
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Tool Owner
Hitech CTF/150/3Z/1200C (UQ)
Oxidation Furnace
QLD
QLD
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Description
Dry thermal oxidation produces high integrity oxides compared to sputtered, evaporated or PECVD films. Dry thermal oxidation of silicon to create SiO2 films up to 300 nm thick. The temperature and gas flow are tightly controlled.
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Related Information
Silicon is heated to more than 1,000°C in an oxygen rich environment. Highly customisable gas flow and temperature profiles.
Sample size of up to 6″ wafers.
Up to 25 wafers per run.
Maximum temperature of 1200°C.
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Tool Owner
Hitech CTF/150/3Z/1200C (MCN)
Wet/dry oxidation furnace
VIC
VIC
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Description
Allows for the wet or dry oxidation of up to 25 wafers in one run. SiO2 growth up to 4µm possible via wet oxidation.
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Related Information
Silicon is heated to more than 1,000°C in an oxygen rich environment. Highly customisable gas flow and temperature profiles.
Sample size of up to 6″ wafers.
Up to 25 wafers per run.
Maximum temperature of 1200°C.
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Tool Owner
