Focused Ion Beam (FIB) milling

Lithography > Direct Write Lithography

Description

Focused Ion Beam (FIB) milling provides significant advantages as a single-step, nanoscale prototyping method that doesn’t require a mask or resist. It is capable of performing: subtractive lithography in which atoms are locally milled away by physical sputtering with sub-10nm resolution; additive...

Key Applications

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List of Available Tools

Tool Make and Model

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FEI Helios NanoLab 600 Dual Beam SEM/FIB (ANU)

Scanning electron microscope with focused ion beam for milling (FIB-SEM)

ACT

ACT

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  • Description

    A multifunction system for nanofabrication, characterisation, and high-resolution imaging

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    Offers high-resolution imaging, milling, patterning, EDS, EBSD and EBIC

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FEI Helios NanoLab 600 Dual Beam (MCN)

Scanning electron microscope with focused ion beam for milling (FIB-SEM)

VIC

VIC

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    Ultra-high resolution three dimensional imaging for topography, surface morphology and maskless ion beam direct lithography.

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    Ultra-high resolution imaging of samples of all sizes up to 6-inch wafers.

    The 5-axis stage and 100mm stage movement add flexibility to this equipment.

    Choice of Secondary Electrons (SE) detector best for topography images and Back-Scattered Electrons (BSE) detector for studies of features deep beneath the surface.

    Ion beam patterning with 30 kV accelerating voltage and variable currents.

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