Menu
Direct laser lithography
Direct laser lithography
Laser processing uses a highly controlled and focused beam of high-energy photons of the same wavelength to burn away material. These processes are repeatable, scalable and cheap, but can induce thermal stresses on the substrate, and resolutions tend to be in the micrometre regime.Laser processing is often used within ANFF to create masks for later lithography steps, but it can also be used to create patterns directly into the substrate itself, skipping several ordinary fabrication steps.
List of available equipment
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Dilase 650
Direct laser lithography system
SA Node
University of South Australia
Description
This equipment offers you the possibility to work with one or two writing lasers, to be focused into one to two beam sizes ranging from 1µm to 50 µm. Writes over a surface area as large as 6 x 6 inches.
Related Information
Used for direct write rapid prototyping and mask fabrication. Writing is possible on any type of substrate, including: photomasks, semiconductors, glass, polymers, crystals, flexible films.
Tool Contact
Simon.Doe@unisa.edu.au
Heidelberg DWL 66+
Direct laser lithography system
NSW Node
University of Sydney
Description
Direct write laser lithography system capable of high resolution and grayscale patterning
Related Information
375 nm laser wavelength, multiple write modes. Capable of achieving sub 500 nm features with highest resolution, alignment, maximum write area 200 x 200 mm
Tool Contact
rpf.queries@sydney.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Dilase 650
Direct laser lithography system
NSW Node
University of Sydney
Description
This equipment offers you the possibility to work with one or two writing lasers, to be focused into one to two beam sizes ranging from 1µm to 50 µm. Writes over a surface area as large as 6 x 6 inches.
Related Information
Used for direct write rapid prototyping and mask fabrication. Writing is possible on any type of substrate, including: photomasks, semiconductors, glass, polymers, crystals, flexible films.
Tool Contact
Simon.Doe@unisa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Heidelberg DWL 66+
Direct laser lithography system
NSW Node
University of Sydney
Description
Direct write laser lithography system capable of high resolution and grayscale patterning
Related Information
375 nm laser wavelength, multiple write modes. Capable of achieving sub 500 nm features with highest resolution, alignment, maximum write area 200 x 200 mm
Tool Contact
rpf.queries@sydney.edu.au