Cleaning

Lithography > Support Systems

Description

Cleaning, an essential step when operating on the micro and nanoscale, is used to remove contaminants from the surface of the substrate before it is used in another fabrication process.

This sometimes means simply burning away material, often using an asher to do this. Ashers use heat to remove unwanted...

Key Applications

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

Tepla Gigabatch 300 (ANU)

Plasma asher

ACT

ACT

  • Description
  • Related Information
  • Tool Owner
  • Description

    Used to strip resist and clean samples.

    Useful during the fabrication of photovoltaic, optoelectronic or nano-photonic technologies as a vital part of the complete lithography process.

  • Related Information

    Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectrics including SiOx

  • Tool Owner

OEM Spin Rinse Dryer - Etch (USYD)

Wafer Cleaning tool

NSW

NSW

  • Description
  • Related Information
  • Tool Owner
  • Description

    Automated batch wafer cleaning tool

  • Related Information

    Can accommodate up to 6 inch round wafers

  • Tool Owner

OEM Spin Rinse Dryer (USYD)

Wafer Cleaning tool

NSW

NSW

  • Description
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  • Tool Owner
  • Description

    Automated batch wafer cleaning tool

  • Related Information

    Can accommodate up to 6 inch square wafers

  • Tool Owner

Denton Asher (UNSW)

Plasma asher

NSW

NSW

  • Description
  • Related Information
  • Tool Owner
  • Description

    More information to come

  • Related Information

    More information to come

  • Tool Owner

Custom Asher (UNSW)

Plasma asher

NSW

NSW

  • Description
  • Related Information
  • Tool Owner
  • Description

    More information to come

  • Related Information

    More information to come

  • Tool Owner

Harrick Plasma PDC-001 & PDC-002 (UQ)

Plasma asher

QLD

QLD

  • Description
  • Related Information
  • Tool Owner
  • Description

    Surface cleaning, sterilisation, activation, energy alteration, and preparation for bonding and adhesion (such as PDMS device fabrication); surface treatment of polymers and biomaterials through activation, grafting and surface coating; modification of surface chemistry

  • Related Information

    Materials used include silicon, glass, PDMS.

    Sample size up to o a 4 inch wafer.

    Oxygen plasma with power of 10 -30 w. Used to activate glass and PDMS surfaces before bonding as part of a soft lithography process.

  • Tool Owner

Harrick Plasma PDC-002 (UQ)

Plasma cleaner

QLD

QLD

  • Description
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  • Tool Owner
  • Description

    For nanoscale surface cleaning and surface activation. Used when making a glass-PDMS or PDMS-PDMS microfluidic chip

  • Related Information

    Provides an organic material etch rate of 5-10 nm/min

  • Tool Owner

PlasmaTech V50 (UniSA)

Plasma asher

SA

SA

  • Description
  • Related Information
  • Tool Owner
  • Description

    Used primarily for ashing photoresist materials from substrates.

  • Related Information

    Used in the fabrication of microfluidic devices. The system can be also used be used for various other surface treatments.

  • Tool Owner

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