Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
Picosun Sunale (ANU)
Atomic layer deposition (ALD) system for depositing Al, Zn, Ti, Hf, Ta, Si oxides and TiN
ACT
ACT
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Description
Load-locked ALD system with thermal and plasma ALD processes
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Related Information
Sources for: Ti, Zn, Al, Si, Hf, Ta, Zr
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Tool Owner
Cambridge NanoTech Savannah S200 (UNSW)
Atomic layer deposition (ALD) system with two precursor sources
NSW
NSW
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Description
More information to come
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Related Information
More information to come
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Tool Owner
Cambridge NanoTech Fiji 200 (MCN)
Plasma assisted atomic layer deposition (PA-ALD) System
VIC
VIC
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Description
The Fiji F200 is capable of both thermal and Plasma Assisted ALD (PA-ALD). PA-ALD expands the window for materials by decreasing activation energy and allows for deposition at lower temperatures to reduce precursor decomposition, deposition times and film contaminations. This tool is equipped to enable Cambridge Nanotech’s unique Exposure Mode™ for thin film deposition on ultra high aspect ratio substrates. In-situ film growth can be monitored using a spectroscopic ellipsometry.
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Related Information
Substrate size – Up to 6 inch diameter.
Maximum substrate heating – 500°C.
Available ALD films- Al2O3, TiO2, SiO2, SnO2, ZnO, Ta2O5, MoO3, HfO2, TiN, AZO.
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Tool Owner
Cambridge NanoTech Savannah S100 (MCN)
Atomic layer deposition (ALD) system in a glovebox
VIC
VIC
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Description
This glovebox-integrated thermal ALD system allows the user to deposit materials in controlled environments.
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Related Information
Available films- Al2O3, TiO2, WO3, NiOx. Compatible up to 4 inch diameter sample size
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Tool Owner