Capabilities
List of Available Tools
Tool Make and Model
Key Differentiator
Node
JetFirst JeFirst (ANU)
Rapid thermal annealer
ACT
ACT
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Description
To anneal and bake semiconductors or polymer samples.
Maximum temperature: 1,400 degrees C (5 minutes max, lower temperatures up to 15 minutes max).
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Related Information
Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectics including SiOx
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Tool Owner
R.D. Webb Red Devil (UniSA)
Vacuum Furnace
SA
SA
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Description
High temperature (1,200°C) vacuum or inert gas furnace for bonding and heat treatments.
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Related Information
Commonly used for microfluidic devices, or during production of small high-value components.
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Tool Owner
SVCS SVSFUR-FP (MCN)
Furnace for atmospheric pressure diffusion, annealing, and LPCVD
VIC
VIC
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Description
The SVCS four-stack horizontal furnace system with a HEPA controlled loading station with small batch processing options. The four processing tubes cater for atmospheric pressure diffusion, atmospheric pressure annealing and the low-pressure chemical vapour deposition of low strain and stoichiometric silicon nitride.
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Related Information
Atmospheric pressure diffusion furnaces – phosphorous and boron doping. Atmospheric pressure annealing/oxidizing (dry) furnace for Si/SiO2 only. LPCVD furnace for silicon nitride with controlled film stress. Batch process – up to 50 wafers. Substrate size – up to 6″ wafers
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Tool Owner
Anealsys AS-One150 RTA (UWA)
Rapid thermal annealer
WA
WA
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Description
A cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber
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Related Information
Process gases: nitrogen, oxygen, forming gas. Max rate of 50°C/s.
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Tool Owner
