Annealing

Materials Synthesis and Modification > Material modification

Description

Annealing is a process that can reduce residual stress in a substrate that has accumulated during prior processes such as deposition.

The material is heated to high temperatures and allowed to cool at a controlled rate. This allows the material’s crystal structure to relax into a less intrinsically...

Key Applications

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List of Available Tools

Tool Make and Model

Key Differentiator

Node

JetFirst JeFirst (ANU)

Rapid thermal annealer

ACT

ACT

  • Description
  • Related Information
  • Tool Owner
  • Description

    To anneal and bake semiconductors or polymer samples.

    Maximum temperature: 1,400 degrees C (5 minutes max, lower temperatures up to 15 minutes max).

  • Related Information

    Available gases include O2 and CF4. The system is suitable to remove organic/polymers but also dielectics including SiOx

  • Tool Owner

R.D. Webb Red Devil (UniSA)

Vacuum Furnace

SA

SA

  • Description
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  • Tool Owner
  • Description

    High temperature (1,200°C) vacuum or inert gas furnace for bonding and heat treatments.

  • Related Information

    Commonly used for microfluidic devices, or during production of small high-value components.

  • Tool Owner

SVCS SVSFUR-FP (MCN)

Furnace for atmospheric pressure diffusion, annealing, and LPCVD

VIC

VIC

  • Description
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  • Tool Owner
  • Description

    The SVCS four-stack horizontal furnace system with a HEPA controlled loading station with small batch processing options. The four processing tubes cater for atmospheric pressure diffusion, atmospheric pressure annealing and the low-pressure chemical vapour deposition of low strain and stoichiometric silicon nitride.

  • Related Information

    Atmospheric pressure diffusion furnaces – phosphorous and boron doping. Atmospheric pressure annealing/oxidizing (dry) furnace for Si/SiO2 only. LPCVD furnace for silicon nitride with controlled film stress. Batch process – up to 50 wafers. Substrate size – up to 6″ wafers

  • Tool Owner

Anealsys AS-One150 RTA (UWA)

Rapid thermal annealer

WA

WA

  • Description
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  • Tool Owner
  • Description

    A cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber

  • Related Information

    Process gases: nitrogen, oxygen, forming gas. Max rate of 50°C/s.

  • Tool Owner

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