ANFF Western Australia
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Overview

ANFF WA provides a wealth of knowledge in advanced microelectronic, optoelectronic, and photonic materials, devices and systems. The node runs a complete, vertically integrated facility, from materials growth, through device design, fabrication and testing, to packaging and subsystem assembly.

The WA node is based at the University of Western Australia, Crawley. It incorporates the Microelectronics Research Group (MRG) in the School of Electrical, Electronic & Computer Engineering, led by Prof Lorenzo Faraone. The MRG provides a wealth of knowledge on advanced microelectronic, optoelectronic, and photonic materials, devices and systems.

Node Competencies

Specialist fields: Semiconductor optoelectronics; II-VI semiconductor growth; Micro- and nano- electro-mechanical-systems (MEMS and NEMS); Advanced sensors.

Flagship Facilities and capabilities: Molecular beam epitaxy, Nanoindentation, DLTS, MEMS characterisation facilities.

Contact

Node Director: Prof Lorenzo Faraone
Email: Lorenzo.faraone@uwa.edu.au
Phone: +61 8 6488 3104

Facility Manager: Prof Mariusz Martyniuk
Email: mariusz.martyniuk@uwa.edu.au
Phone: +61 8 6488 1905

Location
University of Western Australia
Address

School of Electrical, Electronic & Computer Engineering,
Room 4.17, M018, The University of Western Australia
35 Stirling Highway, Crawley WA 6009

Equipment
Deposition
Custom Dual Chamber Thermal Evaporator
Custom dual chamber system for multi-material thermal evaporation
University of Western Australia WA Node
Technique
Thermal evaporation
Description
Custom made dual chamber thermal evaporator for deposition of metal and non-metal materials with high deposition rate and high purity.
Related Information
Materials: Cr, Au, Al, Ag, MgF₂, Ge, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
Custom Indium Thermal Evaporator
Custom system for Indium (In) thermal evaporation
University of Western Australia WA Node
Technique
Thermal evaporation
Description
Thermal evaporator designed for Indium deposition
Related Information
Exclusively for Indium deposition
Tool Contact
anff-wa@uwa.edu.au
Custom Thermal Evaporator
Custom system for Zinc sulfide (ZnS) thermal evaporation
University of Western Australia WA Node
Technique
Thermal evaporation
Description
Thermal evaporator designed for Zinc Sulfide deposition
Related Information
Exclusively for Zinc Sulfide (ZnS) deposition
Tool Contact
anff-wa@uwa.edu.au
4Wave The Laboratory Alloy and Nanolayer System (LANS)
Biased target ion beam deposition system
University of Western Australia WA Node
Technique
Sputtering
Description
Provides atomically engineered thin films and interfaces. The tool can vary process pressures, adatom energies, and provides good uniformity and repeatability.
Related Information
Typical deposited materials: Fe, Pd, Ce, Nb, Ga, Al, Si, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
Oxford Instruments Plasmalab80 plus ICPCVD
University of Western Australia WA Node
Technique
Plasma Enhanced Chemical Vapour Deposition (PECVD)
Description
Plasma Technology Plasmalab80
Related Information
More information to come.
Tool Contact
anff-wa@uwa.edu.au
Sentech SI 500D
System for ICP plasma deposition
University of Western Australia WA Node
Technique
Plasma Enhanced Chemical Vapour Deposition (PECVD)
Description
Variable plasma properties providing high density, low ion energy, and low pressure plasma deposition of dielectric films. A large variety of substrates from wafers up to 200 mm diameter to parts loaded on carriers can be processed.
Related Information
Gases: NH3, N2O, SF6, CH4, CF4, SiH4, O2, H2, etc. Typical deposited materials: Si, SiOx, SiNx, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
Custom 32B Molecular Beam Epitaxy System (Se source)
MBE for II-VI Hg-based semiconductors
University of Western Australia WA Node
Technique
Molecular Beam Epitaxy (MBE)
Description
Versatile tool that deposits precise amounts of material onto substrates. Often used to design and create semiconductor structures for manufacturing many novel devices.
Related Information
Features an in-situ x-ray photoelectron spectroscope for observations during MBE growth.Materials: ultra pure Hg, Cd, Te, CdTe, and II-VI Hg-based semiconductors.
Tool Contact
anff-wa@uwa.edu.au
Edwards Auto 500
Electron beam evaporator
University of Western Australia WA Node
Technique
Electron Beam Evaporation (E-Beam Evaporation)
Description
Ability to deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. The tool allows thick film deposition and also multiple coatings.
Related Information
Materials: Au, Ti, Ge, Pt, Ni, Al, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
Scientific Vacuum Systems V6000
Electron beam evaporator
University of Western Australia WA Node
Technique
Electron Beam Evaporation (E-Beam Evaporation)
Description
Confocal sputtering systems for creating research mirrors. Featuring the same quality of design and components the V6000 research coaters are ideal for single wafer processing.
Related Information
Up to 6-inch diameter confocal sputter magnetron target options. Materials: Ti, Au, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Dual Chamber Thermal Evaporator
Custom dual chamber system for multi-material thermal evaporation
University of Western Australia WA Node
Description
Custom made dual chamber thermal evaporator for deposition of metal and non-metal materials with high deposition rate and high purity.
Related Information
Materials: Cr, Au, Al, Ag, MgF₂, Ge, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Indium Thermal Evaporator
Custom system for Indium (In) thermal evaporation
University of Western Australia WA Node
Description
Thermal evaporator designed for Indium deposition
Related Information
Exclusively for Indium deposition
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Thermal Evaporator
Custom system for Zinc sulfide (ZnS) thermal evaporation
University of Western Australia WA Node
Description
Thermal evaporator designed for Zinc Sulfide deposition
Related Information
Exclusively for Zinc Sulfide (ZnS) deposition
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
4Wave The Laboratory Alloy and Nanolayer System (LANS)
Biased target ion beam deposition system
University of Western Australia WA Node
Description
Provides atomically engineered thin films and interfaces. The tool can vary process pressures, adatom energies, and provides good uniformity and repeatability.
Related Information
Typical deposited materials: Fe, Pd, Ce, Nb, Ga, Al, Si, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Oxford Instruments Plasmalab80 plus ICPCVD
University of Western Australia WA Node
Description
Plasma Technology Plasmalab80
Related Information
More information to come.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Sentech SI 500D
System for ICP plasma deposition
University of Western Australia WA Node
Description
Variable plasma properties providing high density, low ion energy, and low pressure plasma deposition of dielectric films. A large variety of substrates from wafers up to 200 mm diameter to parts loaded on carriers can be processed.
Related Information
Gases: NH3, N2O, SF6, CH4, CF4, SiH4, O2, H2, etc. Typical deposited materials: Si, SiOx, SiNx, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom 32B Molecular Beam Epitaxy System (Se source)
MBE for II-VI Hg-based semiconductors
University of Western Australia WA Node
Description
Versatile tool that deposits precise amounts of material onto substrates. Often used to design and create semiconductor structures for manufacturing many novel devices.
Related Information
Features an in-situ x-ray photoelectron spectroscope for observations during MBE growth.Materials: ultra pure Hg, Cd, Te, CdTe, and II-VI Hg-based semiconductors.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Edwards Auto 500
Electron beam evaporator
University of Western Australia WA Node
Description
Ability to deposit ultra pure films of materials with high melting points, and other materials that are difficult to deposit by resistance evaporation. The tool allows thick film deposition and also multiple coatings.
Related Information
Materials: Au, Ti, Ge, Pt, Ni, Al, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Scientific Vacuum Systems V6000
Electron beam evaporator
University of Western Australia WA Node
Description
Confocal sputtering systems for creating research mirrors. Featuring the same quality of design and components the V6000 research coaters are ideal for single wafer processing.
Related Information
Up to 6-inch diameter confocal sputter magnetron target options. Materials: Ti, Au, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
Etching
Oxford Instruments Plasmalab80
System for plasma enhanced chemical vapour deposition system (PECVD) and reactive ion etching (RIE)
University of Western Australia WA Node
Technique
Reactive Ion Etching (RIE)
Description
Low stress plasma chemical vapour deposition of low-stress films to satisfy mechanical requirement of MEMS devices. Dual Chamber PECVD/RIE
Related Information
Process gases: SiH4, NH3, N2O, O2/CF4. Typical deposited materials: Si, SiOx, SiNx, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Oxford Instruments Plasmalab80
System for plasma enhanced chemical vapour deposition system (PECVD) and reactive ion etching (RIE)
University of Western Australia WA Node
Description
Low stress plasma chemical vapour deposition of low-stress films to satisfy mechanical requirement of MEMS devices. Dual Chamber PECVD/RIE
Related Information
Process gases: SiH4, NH3, N2O, O2/CF4. Typical deposited materials: Si, SiOx, SiNx, and certain other materials upon request.
Tool Contact
anff-wa@uwa.edu.au
Lithography
EVG 105 Bake Module
Photolithography thermal curing
University of Western Australia WA Node
Technique
Spin coating and wafer development
Description
Softbake, post-exposure bake and hardbake processes. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles
Related Information
Process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
EVG 105 Bake Module
Photolithography thermal curing
University of Western Australia WA Node
Description
Softbake, post-exposure bake and hardbake processes. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles
Related Information
Process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time
Tool Contact
anff-wa@uwa.edu.au
Materials Synthesis and Modification
Anealsys AS-One150 RTA
Rapid thermal annealer
University of Western Australia WA Node
Technique
Annealing
Description
A cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber
Related Information
Process gases: nitrogen, oxygen, forming gas. Max rate of 50°C/s.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Anealsys AS-One150 RTA
Rapid thermal annealer
University of Western Australia WA Node
Description
A cold wall bench top rapid thermal processor, to provide high cooling rates and low memory effect of the process chamber
Related Information
Process gases: nitrogen, oxygen, forming gas. Max rate of 50°C/s.
Tool Contact
anff-wa@uwa.edu.au
Packaging
Kulicke & Soffa 4526 Wedge Bonder
Wedge Bonder
University of Western Australia WA Node
Technique
Wire bonding
Description
Manual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid adjustment of individual bonding parameters.
Related Information
Ultrasonically bonding a wide range of gold or aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250 micron ribbon.
Tool Contact
anff-wa@uwa.edu.au
Finetech Fineplacer-96
Flip chip bonder
University of Western Australia WA Node
Technique
Wafer bonding
Description
Manual flip chip bonder with high accuracy of 0.5 μm.
Related Information
Max. die/package size: 16 mm (pick-n-place only)Min. die/package size: 0.5 mmSubstrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Kulicke & Soffa 4526 Wedge Bonder
Wedge Bonder
University of Western Australia WA Node
Description
Manual wedge bonder, simple set-up and incorporates analogue controls for ease of use. This allows rapid adjustment of individual bonding parameters.
Related Information
Ultrasonically bonding a wide range of gold or aluminium wires and ribbons from 12 - 75 micron wire through 25 x 250 micron ribbon.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Finetech Fineplacer-96
Flip chip bonder
University of Western Australia WA Node
Description
Manual flip chip bonder with high accuracy of 0.5 μm.
Related Information
Max. die/package size: 16 mm (pick-n-place only)Min. die/package size: 0.5 mmSubstrate size: 50 mm × 50 mm (thermal compression), 180 mm × 108 mm (pick-n-place only)Bonding mechanism: thermo-compression (bonding force 0.1 ~ 200 N). Reflow (RT ~ 400 °C, heating rate: 20 °C/s), thermo-sonic.
Tool Contact
anff-wa@uwa.edu.au
Testing and validation
Custom DLTS
Deep-level transient spectroscopy (DLTS)
University of Western Australia WA Node
Technique
Other spectroscopy
Description
Characterisation of semiconductor bandgap energy levels using deep-level transient spectroscopy (DLTS)
Related Information
Custom built equipment.
Tool Contact
anff-wa@uwa.edu.au
Custom IR characterisation system
Cryostat IR array characterisation system
University of Western Australia WA Node
Technique
Other spectroscopy
Description
IR transmission/reflection system to characterise spectrometer/filter performance
Related Information
Offers SWIR, MWIR and LWIR characterisation
Tool Contact
anff-wa@uwa.edu.au
Zygo NewView6300
Optical profilometer
University of Western Australia WA Node
Technique
Optical profilometry
Description
Non-contact 3D scanning white light and optical phase-shifting interferometer. Featured modes: Microscope, Films, Stitch and Dynamic MEMS.
Related Information
Vertical resolution up to 0.1 nm. Field of view from 0.04 to 14 mm.
Tool Contact
anff-wa@uwa.edu.au
Olympus LEXT OLS5000
Optical 3D microscope
University of Western Australia WA Node
Technique
Optical microscopy
Description
Provides sub-micron 3D observation/measurement with the ability to compare very rough surface shapes.
Related Information
0.12μm lateral resolution. Long working distance objectives.
Tool Contact
anff-wa@uwa.edu.au
Polytec OFV-500
Laser Doppler Vibrometer (LDV)
University of Western Australia WA Node
Technique
Laser Doppler Vibrometry (LDV)
Description
Non-contact vibration analysis commonly used to characterise MEMS devices. Wide selection of high-performance vibration displacement, acceleration and vibrational velocity decoders that cover the frequency range from DC to 24 MHz, vibrational velocities up to ±25 m/s and displacement resolutions down to 0.1 pm
Related Information
Decoders: VD-02 (velocity, analogue), VD-06 (Velocity, digital), DD-500 (Displacement, digital)
Tool Contact
anff-wa@uwa.edu.au
Agilent Technologies 4156A Semiconductor Parameter Analyzer
Semiconductor parameter analyser
University of Western Australia WA Node
Technique
Electrical characterisation
Description
Digital sweep parameter. Used for failure analysis and automated incoming inspection.
Related Information
Features four built in source measurement units (SMUs), two voltage monitor units (VMUs) and two Voltage Source Unit (VSU). Current resolution to 1fA and the accuracy of to 20fA.
Tool Contact
anff-wa@uwa.edu.au
Custom Electrical Characterisation
Hall effect measurement system
University of Western Australia WA Node
Technique
Electrical characterisation
Description
2T electromagnet to perform Hall effect measurements
Related Information
Magnetic fields ranging from -2 Tesla to +2 Telsa. Controlling the sample temperature between 90K and 350K using liquid nitrogen.
Tool Contact
anff-wa@uwa.edu.au
Rucker & Kolls 680A
Semi-automatic wafer probe station
University of Western Australia WA Node
Technique
Electrical characterisation
Description
Probe station with B&L Microzoom
Related Information
6 inch chuck with 6 x 6 inch travel. Programmable automatic stepping. Manual mode motorised movement.
Tool Contact
anff-wa@uwa.edu.au
Waterloo Scientific LBIC by Waterloo Scientific
Laser Beam Induced Current (LBIC) Scanning Laser Microscope
University of Western Australia WA Node
Technique
Electrical characterisation
Description
Mapping of material quality and device performance using a laser induced current.
Related Information
Features an integrated cryogenic capability.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom DLTS
Deep-level transient spectroscopy (DLTS)
University of Western Australia WA Node
Description
Characterisation of semiconductor bandgap energy levels using deep-level transient spectroscopy (DLTS)
Related Information
Custom built equipment.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom IR characterisation system
Cryostat IR array characterisation system
University of Western Australia WA Node
Description
IR transmission/reflection system to characterise spectrometer/filter performance
Related Information
Offers SWIR, MWIR and LWIR characterisation
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Zygo NewView6300
Optical profilometer
University of Western Australia WA Node
Description
Non-contact 3D scanning white light and optical phase-shifting interferometer. Featured modes: Microscope, Films, Stitch and Dynamic MEMS.
Related Information
Vertical resolution up to 0.1 nm. Field of view from 0.04 to 14 mm.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Olympus LEXT OLS5000
Optical 3D microscope
University of Western Australia WA Node
Description
Provides sub-micron 3D observation/measurement with the ability to compare very rough surface shapes.
Related Information
0.12μm lateral resolution. Long working distance objectives.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Polytec OFV-500
Laser Doppler Vibrometer (LDV)
University of Western Australia WA Node
Description
Non-contact vibration analysis commonly used to characterise MEMS devices. Wide selection of high-performance vibration displacement, acceleration and vibrational velocity decoders that cover the frequency range from DC to 24 MHz, vibrational velocities up to ±25 m/s and displacement resolutions down to 0.1 pm
Related Information
Decoders: VD-02 (velocity, analogue), VD-06 (Velocity, digital), DD-500 (Displacement, digital)
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Agilent Technologies 4156A Semiconductor Parameter Analyzer
Semiconductor parameter analyser
University of Western Australia WA Node
Description
Digital sweep parameter. Used for failure analysis and automated incoming inspection.
Related Information
Features four built in source measurement units (SMUs), two voltage monitor units (VMUs) and two Voltage Source Unit (VSU). Current resolution to 1fA and the accuracy of to 20fA.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Custom Electrical Characterisation
Hall effect measurement system
University of Western Australia WA Node
Description
2T electromagnet to perform Hall effect measurements
Related Information
Magnetic fields ranging from -2 Tesla to +2 Telsa. Controlling the sample temperature between 90K and 350K using liquid nitrogen.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Rucker & Kolls 680A
Semi-automatic wafer probe station
University of Western Australia WA Node
Description
Probe station with B&L Microzoom
Related Information
6 inch chuck with 6 x 6 inch travel. Programmable automatic stepping. Manual mode motorised movement.
Tool Contact
anff-wa@uwa.edu.au
TOOL MAKE AND MODEL
KEY DIFFERENTIATOR
LOCATION
Waterloo Scientific LBIC by Waterloo Scientific
Laser Beam Induced Current (LBIC) Scanning Laser Microscope
University of Western Australia WA Node
Description
Mapping of material quality and device performance using a laser induced current.
Related Information
Features an integrated cryogenic capability.
Tool Contact
anff-wa@uwa.edu.au
Experts
Jarek Antoszewski
Senior MBE engineer
Jarek is providing expertise in IR detectors fabrication and characterisation.
Read More
University of Western Australia
Contact Jarek Antoszewski
Prof Lorenzo Faraone
Node Director
Lorenzo Faraone is a Member of the Order of Australia (AM), and a Fellow of the Institute of Electrical and Electronic Engineers (FIEEE), the Australian Academy of Science (FAA) and the Australian Academy of Technological Sciences and Engineering (FTSE). He has published more than 300 international journal papers on his research work, and supervised more than 40 PhD student completions. He is currently Head of the Microelectronics Research Group (MRG) at The University of Western Australia (UWA), and Director of the WA Node of the Australian National Fabrication Facility (ANFF). Prior to joining UWA in 1987, he worked primarily in the area of silicon CMOS-based microelectronics and non-volatile memory technology with RCA Labs in Princeton, NJ, USA. Since joining UWA he has worked on compound semiconductor materials and devices, including AlGaN/GaN HEMTs, HgCdTe-based infrared sensor technology and MBE growth, as well as optical MEMS technologies for infrared spectroscopy and imaging applications. His research activities also include mobility spectrum analysis techniques for magneto-transport studies, which allow the transport properties and mobility distributions of individual carriers in multi-layer/multi-carrier semiconductor systems to be determined.
Read More
University of Western Australia
Contact Prof Lorenzo Faraone
Ken Fogden
Technical manager
Ken is the Technical Manager, he is responsible for upgrades to the cleanroom itself and equipment within it, he has an internal and external networks of support staff.
Read More
University of Western Australia
Contact Ken Fogden