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Inductively coupled plasma Reactive-ion etcher ICP RIE

Inductively coupled plasma Reactive-ion etcher ICP RIE

Fabrication step: Micro and nano fabrication
Function: Etching
Location: University of Western Australia
Purpose: Etching/diode formation
Material systems: Si-N-O/ H-Cd-Te/ Al-Ga-N-O
Node: Western Australia
Scale/volume: up to 4 inch wafers
Specifications/resolution: H2/CH4/He/Ar/N2/SF6/CF4