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Prog 200 reactive ion etching system RIE

Prog200 single wafer reactive ion etching (RIE) system is used to etch various materials, such as silicon dioxide, silicon nitride and polymers. It is also used as O2 ashing to remove photoresists from substrates.

The system has been equipped with CF4, SF6, O2 and Ar as etching gases.

Fabrication step: Micro and nano fabrication
Function: Etching
Location: University of Queensland
Purpose: Essentially a reactive ion etcher to remove material deposited on wafers.
Material systems: Any
Node: Queensland
Scale/volume: Single wafer
Specifications/resolution: Etching photoresist, silicon nitrite and other materials. Gases: SF6, CF4, oxygen and argon. Edwards diaphragm pump with large capacity and water chilled