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Neutronix Quintell 7500 UV mask aligner

The Neutronix Quintell (NXQ) 7500 UV mask aligner combines ‘open architecture’ modular design with precision alignment and exposure features. It supports vacuum, contact and proximity printing and handles partial and whole substrates up to 200mm (8 inch) diameter.

The most important of its features are: wafer sizes from pieces to 200mm (8 inch) diameter or substrates up to 6x6 inches, fully motorized X-Y-Z alignment stage, multiple contact and proximity exposure modes, videoview CCTV splitfield, singlefield microscope with zoom, choice of UV exposure PSUs – 200/350, 350/500 watt and 500/1Kw, shock isolation table included as standard, easily configurable for a wide variety of applications and options with low maintenance.

It is used in microfabrication research laboratories and in even in low- volume production facilities to generate patterns of:

  • Microelectronics chips
  • Opto-electronics
  • Micro-electro mechanical systems
Fabrication step: Micro and nano fabrication
Function: Lithography
Location: University of Queensland
Purpose: Photolithography with precision alignment and exposure features for microfabrication, low volume production facilities to align features on a substrate (wafer) to features on a photomask
Material systems: Organic, photoresist or any UV sensitive polymer
Node: Queensland
Scale/volume: Wafer sizes from pieces to 200mm (8 inch) diameter or substrates up to 6x6inches with one sample at a time
Specifications/resolution: Fully motorized X Y Z alignment stage, multiple contact and proximity exposure modes, videoview CCTV, splitfield microscope with zoom, UV collimation lens, print resolution <1.0 microns, topside alignment overlay < 0.5 microns, UV exposure 350, 450 nm