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HMDS hexamethyldisilzane oven

The Yield LP3 hexamethyldisilzane (HMDS) vapour prime oven is use to deposited HMDS on silicon wafer for better adhesion of certain photoresist.

The oven is microprocessor controlled and is equipped with a Lark logical sequencer athena temperature controller with a chamber size of 12 inch x 12 inch x 12 inch and maximum temperature of 300°C with temperature stability +/- 2%.

Fabrication step: Micro and nano fabrication
Function: Clean rooms and associated equipment
Location: University of Queensland
Purpose: Vapor priming allows the application of HMDS (hexamethyldisilzane) in a monolayer for maximum adhesion of photoresist in a completely free of moisture environment
Material systems: Silicon and glass wafers
Node: Queensland
Scale/volume: 150 mm ( 6 inches) and single up to 8 inch wafers
Specifications/resolution: Microprocessor control of output with input monitoring, multi programming capabilities, program lock out, cycle complete/abort, light and sonalert, electropolished 316 stainless steel chamber with the internal chamber welds two independent chambers and an overtemperature safety control