EVG-620 mask aligner

EVG620 is an automated versatile mask aligner (MA) equipped with high resolution top side and bottom side split field microscopes. Suitable for substrate sizes from 100mm up to 150mm with the associated tooling and handling components. This mask aligner is configured with a 350W Mercury arch lamp house with optimized parallel light for processing of various resist thicknesses without any lamp house adjustments. The MA is also equipped with the removable 'i-line filter' for better results in using photoresist that require 365 nm wavelength and above. The su8 series of photoresist atre examples of these.

The automated alignment routine with live image or synthetic alignment key models using cognex patmax enables the highest throughput and the best repeatability alignment. Alignment reliability and accuracy are further optimized with the UV-NIL system with nanoalign package.

The system can be operated in proximity (only 6inches), soft contact, hard contact or vacuum contact exposure modes. Tooling exchanges are quick, simple and can be performed within minutes using Microsoft windows based user interface and the sophisticated system design. This EVG-620 mask and bond alignment tool is complementary tool to EVG520 HE hot embossing tool which was recently added to the facility. In particular, this tool will be useful for bond alignment in combination with EVG hot embosser.

In addition to this, the system is upgraded to a UV-NIL system will further enhance the capability of the facility to fabricated bio-micro/nano device for bio and chemical applications. The new fully automated mask alignment system is equipped with three cassette stations to enable automatic and continuous wafer processing. This robotic mechanism of the EVG620 delivers unparalleled throughput of up to 25 six-inch wafers per hour (up to 220 wafers per hour in first print mode) with the industry’s highest alignment accuracy and yield.