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157 nm F2 laser exposure system

Lasers are used for applications that required a light source that has a highly specific wavelength with a very narrow slit width. Lasers are used quite frequently in nano and micro-lithography processes (often referred to as photo-lithography) for the manufacture of soft-polymer resists so that nano- or micron-sized features can be etched onto silicon wafers or chips.

ANFF has access to two laser systems: An excimer 193nm ArF laser and excimer 157nm F2 laser. The lasers are connected to a specialised optics system for a customized beam area.

Examples of Use

  • Optical features below 37nm can be etched into wafers using immersion lithography with the refractive index of the immersed liquid (liquid between the laser lens and resist material) being the limit on the feature size.
  • Features around the 65nm size can be obtained using the 157nm and 193nm lasers using photolithography. Optical masks for the design of silicon wafers or chips, for gratings in fine optical systems or for micro-needles for biological applications can be made using photo¬resists such as poly(methyl methacrylate-stat-methacrylic acid) made with these laser systems.
Fabrication step: Micro and nano fabrication
Function: Lithography
Location: University of Queensland
Purpose: For testing of 157nm developed polymer resists
Material systems: Organic and inorganic
Node: Queensland
Scale/volume: individual sample/system analysis
Specifications/resolution: 1 350Hz pulse rate and 10 14 filament voltage;