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Hollow-cathode reactive ion etching system

Hollow-cathode reactive ion etching system

Fabrication step: Micro and nano fabrication
Function: Etching
Location: University of New South Wales
Purpose: etching of a range of materials
Material systems: Most substrates
Node: New South Wales
Scale/volume: Single wafer up to 75mm diameter
Specifications/resolution: available etch gases: O2, SF6, CF4, CHF3, Ar, CH4; 30-600W rf power