Capability directory

Types of fabrication

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Device fabrication, packaging and testing capabilities
K&S Au ball bonder - University of New South Walesview more details
K&S Au ball bonder (digital) - University of New South Walesview more details
K&S 4523 Al wedge bonder - University of New South Walesview more details
Wire bonder - Royal Melbourne Institute of Technology Universityview more details
Agilent 4294A impedance analyzer - Monash Universityview more details
High voltage pulse high freq signal generation - Monash Universityview more details
Polytec PI MEMS LDV MSA 400 3D vibrometer - Monash Universityview more details
Wire bonding - Monash Universityview more details
Advantest R3762A Network Analyser - Monash Universityview more details
Automated Die - Flip Chip Device Bonder - Melbourne Centre for Nanofabricationview more details
Ball and wire bonder - Melbourne Centre for Nanofabricationview more details
Org Polym Solar Cell glove box evap spin coats ALD - Melbourne Centre for Nanofabricationview more details
Oscilloscope network analyser Electrical measure - Melbourne Centre for Nanofabricationview more details
PH and conductivity meters - Melbourne Centre for Nanofabricationview more details
Photovoltaics characterisation suite - Melbourne Centre for Nanofabricationview more details
software packages and testing tools - Melbourne Centre for Nanofabricationview more details
Precision Dicing and Polishing - Macquarie Universityview more details
Electrical Poling System - Bandwidth Foundry Internationalview more details
Dicing saw - Bandwidth Foundry Internationalview more details
Karl Suss Model PM5 Probe Stat - Bandwidth Foundry Internationalview more details