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Wire and Flip-Chip Bonding

Wire and Flip-Chip Bonding

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: University of Western Australia
Purpose: wire bonding, flip-chip bonding
Material systems: Si-N-O/ H-Cd-Te/ Al-Ga-N-O/ BIG
Node: Western Australia
Scale/volume: up to 2 inch wafers
Specifications/resolution: ultrasonic thermocompression flip-chip