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Wafer dicer

The Disco DAD 321 saw features versatile processing capabilities but maintains high precision and reliability. Users perform workpiece loading, alignment, and unloading manually. Substrates up to 6” diameter and 3 mm in thickness are mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame.

Fabrication step: Device fabrication, packaging and testing
Function: Microfluidics & packaging and testing
Location: University of South Australia
Purpose: To cut substrates or final product to size
Material systems: Si wafer, Quartz & pyrex glass, plastics and metals
Node: South Australia