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Wire bonder

K&S 4500 manual ball bonding system provides the high yield and excellent repeatability needed for gold ball bonding applications.

This includes:

  • Optoelectronic Modules
  • Hybrid/MCMs
  • Microwave Products
  • Discrete Devices/Lasers
  • Chip-on-Board
Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: University of Queensland
Purpose: Packaging and microelectronics interfacing of devices to prototype level
Material systems: Gold and Silver
Node: Queensland
Scale/volume: Single sample bonding
Specifications/resolution: Pad size of 80 microns and wire diameter of 25 microns