Capability directory

Types of fabrication

Function

Location

Or use capability keyword(s)

Packaging and testing capabilities
K&S Au ball bonder (digital) - University of New South Walesview more details
Wire bonder - Royal Melbourne Institute of Technology Universityview more details
Advantest R3762A Network Analyser - Monash Universityview more details
Agilent 4294A impedance analyzer - Monash Universityview more details
High voltage pulse high freq signal generation - Monash Universityview more details
Wire bonding - Monash Universityview more details
Automated Die - Flip Chip Device Bonder - Melbourne Centre for Nanofabricationview more details
Ball and wire bonder - Melbourne Centre for Nanofabricationview more details
Oscilloscope network analyser Electrical measure - Melbourne Centre for Nanofabricationview more details
PH and conductivity meters - Melbourne Centre for Nanofabricationview more details
software packages and testing tools - Melbourne Centre for Nanofabricationview more details
Precision Dicing and Polishing - Macquarie Universityview more details
Electrical Poling System - Bandwidth Foundry Internationalview more details
Dicing saw - Bandwidth Foundry Internationalview more details
Karl Suss Model PM5 Probe Stat - Bandwidth Foundry Internationalview more details
West bond (model 747677E) wire bonder - Australian National Universityview more details
Electrical measurements - Australian National Universityview more details
K&S (ADT) 7100 Vectus dicing saw - Australian National Universityview more details