Capability directory

Types of fabrication

Function

Location

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Packaging and testing capabilities
Wire bonder - CSIRO Lindfieldview more details
Flip chip bonder - Australian National Universityview more details
Wedge bonder - University of Newcastleview more details
Scale up synthesis characterisation tools - University of Wollongongview more details
Wire and Flip-Chip Bonding - University of Western Australiaview more details
I-V/ C-V/ DLTS/ Hall Effect Measurement Systems - University of Western Australiaview more details
Optical Characterisation Facilities - University of Western Australiaview more details
Wafer dicer - University of South Australiaview more details
Optical Microfluidics Workstation - University of South Australiaview more details
Organic device and electronics circuit testing - University of Queenslandview more details
Wire bonder - University of Queenslandview more details
Wafer dicer - University of Queenslandview more details
Agilent semiconductor device analyser - University of Queenslandview more details
Semiautomatic probe station - University of Queenslandview more details
Four point probe - University of New South Walesview more details
Micromanipulator probe station - University of New South Walesview more details
DAD3240 dicing saw - University of New South Walesview more details
Karl Suss Wafer Scriber - University of New South Walesview more details
K&S Au ball bonder - University of New South Walesview more details
K&S Au ball bonder (digital) - University of New South Walesview more details