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Precision Dicing and Polishing

Precision Dicing and Polishing

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: Macquarie University
Purpose: Lapping machine and mounting device to enable precision polishing of optical materials. Diamond saws (wire saw angular saw and sectioning saw) to enable pre processing of thick glass samples.
Material systems: Glass crystal only
Node: OptoFab
Scale/volume: Mounting device: Process of chips up to 50 x 50mm or multiple chips of size 10x10mm. Diamond dicing saw: process glass samples >10mm thick
Specifications/resolution: Polishing to < lambda / 4 surface roughness