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K&S Au ball bonder (digital)

K&S Au ball bonder (digital)

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: University of New South Wales
Purpose: chip bonding
Material systems: Au wire bonding
Node: New South Wales
Scale/volume: manual or automatic bonding (single chip)
Specifications/resolution: recommended minimum pad size 150micron x 150micron