Capability directory

Types of fabrication



Or use capability keyword(s)

DAD3240 dicing saw

DAD3240 dicing saw

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: University of New South Wales
Purpose: wafer dicing
Material systems: Semiconductors, glass, quartz, sapphire
Node: New South Wales
Scale/volume: Single wafer up to 200mm diameter
Specifications/resolution: 1800W; 6000-60000rpm