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Wedge bonder

A wedge- or wire- bonder is used to make connections between contact pads on an electronic chip and the pins that are used to connect an integrated circuit to other components.

The sample (the "chip") can be accurately positioned (manually) using a microscope so that the ultrasonic wire bonder, sometimes in conjunction with heat, can be used to bond a wire (aluminium or gold) to the chip and then to a nearby contact point. Applications include optoelectronic modules (detectors, lasers) and other discrete devices.

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: University of Newcastle
Purpose: Electrical connection to devices
Material systems: Metals
Node: Materials
Scale/volume: Single chip