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West bond (model 747677E) wire bonder

Wire bonding is a method of making interconnects using gold wires between semiconductor devices and packages. It features wedge-wedge and ball-wedge bonding.

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: Australian National University
Purpose: Gold wire bonding
Material systems: III-V/ Si
Node: Australian Capital Territory
Scale/volume: manual
Specifications/resolution: Wedge bonding (Au and Al wires)