Capability directory

Types of fabrication



Or use capability keyword(s)

K&S (ADT) 7100 Vectus dicing saw

Dicing system suitable for precision wafer dicing up to 200mm.

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: Australian National University
Purpose: Dicing
Material systems: Semiconductors, Quartz, Glass
Node: Australian Capital Territory
Scale/volume: 200 mm