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Flip chip bonder

Flip Chip bonding is a technology that allows bonding various type of devices/chips onto a different substrate like bonding a laser/LED onto a Si-chip to add optoelectronic function to the well-established microelectronic and Si-based photonic circuitry that lack active devices (lasers and detectors) operating at the telecommunication wavelength of 1.55 μm.

Solder attachment of components remains the most used assembly method, with solder-bumped flip chip in high density assemblies like AuSn solder that has become the material of choice for flip chip mounting of precision optical dies.

The ANFF ACT Node Fineplacer Lambda tool allows an alignment accuracy of 0.5 μm.

Fabrication step: Device fabrication, packaging and testing
Function: Packaging and testing
Location: Australian National University
Purpose: Flip-chip bonding
Node: Australian Capital Territory
Specifications/resolution: Allows an alignment accuracy of 0.5 μm.