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Diamond Scribe and Saw

Diamond Scribe and Saw.

Separation of individual device dies following wafer scale lithography is accomplished using either a wet or dry dicing process. In a wet dicing operation, a precision high-speed diamond impregnated blade is used to mill narrow grooves between adjacent dies either partially or completely through a wafer(s). During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates. In a dry process, a diamond tipped stylus is drawn across the wafer surface creating lines of high-stress which are later broken over precision fulcrum. Done properly, this processing technique is debris free. Choice of the appropriate process will be apparent from the target application and materials.

The MCN houses two computerized wafer dicing instruments. The Disco DAD321 automated dicing saw, for wet dicing processes, and the Dynatex DTX - Scriber/Breaker for dry processing.

Fabrication step: Characterisation
Function: Bulk microscopy
Location: Melbourne Centre for Nanofabrication
Purpose: Wafer separation is a staple process in micro and nanofabrication.
Material systems: All
Node: Victoria